The ESP32-S3-WROOM-1U-N8R8 Module is a compact and powerful wireless module designed for AIoT, IoT, smart devices, embedded systems, and wearable applications. It combines 2.4 GHz Wi-Fi and Bluetooth Low Energy (BLE) connectivity with multiple peripheral interfaces, making it suitable for developing intelligent and connected electronic products.

With its low-voltage operation, compact form factor, high wireless data rate, and reliable connectivity, this module provides a flexible solution for applications that require wireless communication and efficient embedded processing.

Key Features

• 2.4 GHz Wi-Fi: Supports IEEE 802.11 b/g/n wireless connectivity.
• Bluetooth 5.0 BLE: Enables reliable low-power wireless communication.
• Wireless Output Power: Up to 20.5 dBm for dependable connectivity.
• High Data Rate: Supports wireless data rates of up to 150 Mb/s.
• Multiple Interfaces: Supports I2C, I2S, SPI, PWM, UART, and USB interfaces.
• Low Supply Voltage: Operates within a 3.0 V to 3.6 V supply range.
• Compact Form Factor: Measures approximately 25.5 × 18 × 3.1 mm.
• Integrated Antenna: PCB antenna design simplifies wireless integration.
• Wide Temperature Range: Suitable for operating temperatures from -40°C to +65°C.
• RoHS Compliant: Designed to meet applicable environmental and material requirements.
• Moisture Sensitive: Requires appropriate handling and storage during manufacturing and assembly.

Applications

The ESP32-S3-WROOM-1U-N8R8 module can be used in a wide range of connected and intelligent electronic applications, including:

• AIoT devices
• Smart home systems
• Industrial IoT solutions
• Wearable devices
• Wireless sensors
• Smart appliances
• Connected consumer electronics
• Embedded control systems
• IoT gateways and controllers
• Remote monitoring systems
• Voice and intelligent devices
• Portable and battery-powered products

Product Benefits

The ESP32-S3-WROOM-1U-N8R8 Module offers a combination of wireless connectivity, multiple interfaces, compact dimensions, and low-voltage operation. Its flexible connectivity options make it suitable for developing next-generation IoT, AIoT, wearable, and smart embedded products while helping reduce PCB space and simplify product design.